Silicon Microsystems Ltd

ASIC Design, Package, Test and Supply

Tel:
01666 - 827620

Test Services

Silicon Microsystems' comprehensive test capability provides both prototype and production test of analogue, digital and mixed signal integrated circuits for commercial, industrial and hi-rel applications.

Test Philosophy

Our test philosophy is based around four different test regimes

Initial probing of the die on the silicon wafer
Characterisation of the packaged device
Production probe test
Final production testing of the finished device

Inspecting prober

Initial Probe

The initial probe test selects fully functional die from the wafer and rejects non-functional devices, to provide some confidence that finished parts will be functional when assembled. Parametrics are not checked at this stage.

Device Characterisation

	A large sample of parts is tested under many different conditions (electrical & environmental) to ensure that packaged parts are fully functional at all extremes of the specification. By taking a large number of measurements, this test also provides worst case parametric data for the device. The results may be used to fine tune production probe and final test specifications.
Developing test procedures

Production Probe

The production probe test is often identical to the initial probe test. It may be modified to utilise results from device characterisation or to reduce test cost.

Final Test

The final production test uses the production probe test programme and often includes parametric testing.

Test facilities include:

Automatic wafer probe
PC controlled instrumentation for analogue and mixed signal testing
Speedy provision of customised test hardware utilising our proprietary TACT (Test Adaptor & Control Terminal)
Customised PC controlled test hardware
Test equipment calibrated to International Standards
Environmental test chambers for burn-in and temperature cycling

Environmental Chamber

Silicon Microsystems' test services are available for any ASIC.